As a professional XC2V250-4FG256I Xilinx supplier, we would like to provide you XC2V250-4FG256I Xilinx. Welcome new and old customers to continue to cooperate with us to create a better future! XC2V250-4FG256I Xilinx is an FPGA chip designed and developed by Xilinx. It is part of Xilinx's Virtex-II family, providing a complete solution for telecom, wireless, networking, video, and DSP applications. At present, it is one of the more shortage chips in the market. To purchase or learn more about high-end electronic components, please contact XT-ShenZhen® !!!
XC2V250-4FG256I Xilinx is an FPGA chip designed and developed by Xilinx. It is part of Xilinx's Virtex-II family, providing a complete solution for telecom, wireless, networking, video, and DSP applications. At present, it is one of the more shortage chips in the market. To purchase or learn more about high-end electronic components, please contact XT-ShenZhen® !!!
The XC2V250-4FG256I Xilinx is a Features-II series developed for high performance in low-density to high-density designs based on IP cores and custom modules. Has PCI, LVDS, and DDR interfaces. The leading 0.15 μm / 0.12 μm CMOS 8-layer metal process and Virtex-II architecture are optimized for high speed and low power consumption. The Virtex-II series combines multiple flexibilities with a large density of up to 10 million system gates to enhance programmable logic design capabilities and is a powerful alternative to mask programming gate arrays. Products include ball grid array (BGA) packages with 0.80 mm, 1.00 mm, and 1.27 mm pitches. In addition to traditional lead bonding interconnects, some BGA products use flip-chip interconnects. The use of flip-chip interconnects provides more I/O than lead-bonded versions of similar packages.
• IP-Immersive Architecture - Density from 40K to 8M System Gate - 420 MHz Internal Clock Speed (Advanced Data) - 840+ Mb/s I/O (Advanced Data).
•SelectRAM™ memory hierarchy
• Arithmetic functions - dedicated 18-bit x 18-bit multiplier module - fast forward logic chain
• Flexible logic resources – up to 93,184 internal registers/latches
• High-performance clock management circuitry - up to 12 DCM (Digital Clock Manager) modules
• Programmable sink current per I/O (2 mA to 24 mA) - Digitized controlled impedance (DCI) I/O:
•Coupling logic with current drive buffer and low voltage positive emitter
•SRAM-based in-system configuration - Fast SelectMAP configuration - Triple Data Encryption Standard (DES).
• Bitstream encryption - IEEE 1532 support - partial reconfiguration - unlimited reprogramming capability - read-back capability
• 0.15 μm 8-layer metal process with 0.12 μm high-speed transistors
• 1.5V (VCCINT) core power supply, dedicated 3.3V VCCAUX auxiliary, and VCCO I/O
power supplies
•IEEE 1149.1 compliant boundary scan logic support
• Flip chip and wire-bond ball grid array (BGA) packages are available in three standard fine pitches (0.80 mm, 1.00 mm, and 1.27 mm).
• Wire bond BGA devices in lead (Pb) free packages
|
Technical parameters |
Supply voltage |
1.425V ~ 1.575V |
|
Installation mode |
Surface Mount |
|
|
encapsulation |
FBGA-256 |
|
|
Operating temperature |
-40℃ ~ 100℃ (TJ) |
|
|
Product life cycle |
Obsolete |
|
|
Packaging |
Tray |
|
|
RoHS standard |
Non-Compliant |
|
|
Leaded standard |
Contains Lead |
Q: Are you a trader or a manufacturer?
A: Yes, we are traders. XC2V250-4FG256I Xilinx we sell are purchased directly from the factory.
Q: What is your MOQ?
A: We will decide according to the product packaging method, and will communicate with you in time before placing an order.
Q: Are your shipments fast?
A: Yes, we have our own warehouse, and most of the goods are in stock. Same-day delivery can be achieved as soon as possible.
